Patent Assignment
Reel/Frame 060782/0308
Assignment of Assignor's Interest
Recorded: 2022-08-11
Pages: 3
Assignor
LIAW, JHON JHY
Executed: 2022-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure with Backside Power Mesh and Method of Forming the Same