Patent Assignment
Reel/Frame 060789/0777
Assignment of Assignor's Interest
Recorded: 2022-08-11
Pages: 7
Assignors
JUNG, HYEONOK
Executed: 2022-07-11
PARK, HYOJIN
Executed: 2022-07-11
SUNG, HOJIN
Executed: 2022-07-11
LEE, JI-EUN
Executed: 2022-07-11
CHO, YOUNG-SEUNG
Executed: 2022-07-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same
Application:
17/819,295 →
Publication:
US 2023/0209814