IP Library › Assignment 060797/0203
Patent Assignment
Reel/Frame 060797/0203

Assignment of Assignor's Interest

Recorded: 2022-08-12 Pages: 3
Assignors
KOBAYASHI, SHINGO
Executed: 2022-07-20
KIMURA, YUKO
Executed: 2022-07-20
Assignee
FUJI POLYMER INDUSTRIES CO., LTD.
21-11, CHIYODA 5-CHOME, NAKA-KU, NAGOYA-SHI, AICHI, 460-0012, JAPAN
Covered Property (1)
Thermally Conductive Silicone Heat Dissipation Material
Application: 17/799,526 →
Publication: US 2023/0097362
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Feb 6, 2023
From: FUJI POLYMER INDUSTRIES CO., LTD.
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 062655/0927 →