Patent Assignment
Reel/Frame 060798/0621
Assignment of Assignor's Interest
Recorded: 2022-08-12
Pages: 3
Assignors
TSAI, TSUNG-FU
Executed: 2022-06-14
HSIA, HSING-KUO
Executed: 2022-06-14
LU, SZU-WEI
Executed: 2022-06-17
YU, CHEN-HUA
Executed: 2022-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photonic Package and Method of Manufacture