Patent Assignment
Reel/Frame 060800/0645
Assignment of Assignor's Interest
Recorded: 2022-08-12
Pages: 2
Assignor
VANKAYALA, VIJAYAKRISHNA J.
Executed: 2022-08-12
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Inter-Die Signal Load Reduction Technique in Multi-Die Package