Patent Assignment
Reel/Frame 060801/0606
Assignment of Assignor's Interest
Recorded: 2022-08-14
Pages: 3
Assignors
LIN, TZU-GING
Executed: 2022-07-26
TAI, CHEN-YU
Executed: 2022-06-29
LAI, CHUN-LIANG
Executed: 2022-07-26
HUNG, CHIH-CHANG
Executed: 2022-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming an Isolation Region in a Semiconductor Device Structure
Application:
17/837,833 →
Publication:
US 2023/0402521