Patent Assignment
Reel/Frame 060802/0521
Assignment of Assignor's Interest
Recorded: 2022-08-15
Pages: 4
Assignors
LIN, PO-YAO
Executed: 2022-07-31
KUO, SHENG-LIANG
Executed: 2022-08-11
LIN, YU-SHENG
Executed: 2022-07-31
YAN, KATHY
Executed: 2022-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Thermal Module for a Semiconductor Package and Methods of Forming the Same