Patent Assignment
Reel/Frame 060811/0015
Assignment of Assignor's Interest
Recorded: 2022-08-15
Pages: 6
Assignors
CHEN, CHIEH-WEI
Executed: 2022-04-27
LIAN, JIAN-JOU
Executed: 2022-04-28
CHIANG, TZU-ANG
Executed: 2022-04-17
WANG, PO-YUAN
Executed: 2022-07-27
WANG, YU-SHIH
Executed: 2022-04-17
LIN, CHUN-NENG
Executed: 2022-04-20
YEH, MING-HSI
Executed: 2022-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device