Patent Assignment
Reel/Frame 060812/0910
Assignment of Assignor's Interest
Recorded: 2022-08-15
Pages: 6
Assignors
KIM, CHOONGSUN
Executed: 2022-07-12
MAEDA, SHIGENOBU
Executed: 2022-07-12
PARK, MYOUNGKYU
Executed: 2022-07-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Semiconductor Device
Application:
17/819,936 →
Publication:
US 2023/0143543