Patent Assignment
Reel/Frame 060820/0225
Assignment of Assignor's Interest
Recorded: 2022-08-16
Pages: 4
Assignors
KUO, SHENG-LIANG
Executed: 2022-08-16
LIN, PO-YAO
Executed: 2022-08-14
YAN, KATHY
Executed: 2022-08-15
YU, COOPER
Executed: 2022-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Thermal and Mechanical Enhanced Thermal Module Structure on Heterogeneous Packages and Methods for Forming the Same