Patent Assignment
Reel/Frame 060835/0711
Assignment of Assignor's Interest
Recorded: 2022-08-17
Pages: 7
Assignors
SHIN, DONGSUK
Executed: 2022-07-13
YU, HYUN-KWAN
Executed: 2022-07-14
LEE, SUNYOUNG
Executed: 2022-07-14
CHA, JI HOON
Executed: 2022-07-25
HWANG, KYUNGYEON
Executed: 2022-07-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same