Patent Assignment
Reel/Frame 060857/0600
Assignment of Assignor's Interest
Recorded: 2022-08-22
Pages: 6
Assignors
LEE, JANGGEUN
Executed: 2022-08-15
CHOI, JAEMYUNG
Executed: 2022-08-17
HONG, WONHYUK
Executed: 2022-08-19
SEO, KANG-ILL
Executed: 2022-08-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Metal Lines Spaced Apart from Metal Vias, and Related Fabrication Methods