IP Library › Assignment 060860/0936
Patent Assignment
Reel/Frame 060860/0936

Assignment of Assignor's Interest

Recorded: 2022-08-22 Pages: 3
Assignors
CHEN, YI-JUNG
Executed: 2022-08-18
TSAI, TSUNG-FU
Executed: 2022-08-20
LU, SZU-WEI
Executed: 2022-08-21
LIU, CHUNG-SHI
Executed: 2022-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device and Method Forming Same
Application: 17/892,821 →
Publication: US 2024/0063204