Patent Assignment
Reel/Frame 060861/0124
Assignment of Assignor's Interest
Recorded: 2022-08-22
Pages: 3
Assignors
JAO, MENG-HUAN
Executed: 2022-08-08
HUANG, LIN-YU
Executed: 2022-08-08
SU, HUAN-CHIEH
Executed: 2022-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Reverse-Cut Source/Drain Contact Structure and Method Thereof