Patent Assignment
Reel/Frame 060866/0743
Assignment of Assignor's Interest
Recorded: 2022-08-23
Pages: 4
Assignors
HUANG, LI-HSIEN
Executed: 2022-08-22
CHENG, HSUEH-LUNG
Executed: 2022-08-23
CHUANG, YAO-CHUN
Executed: 2022-08-22
LU, YINLUNG
Executed: 2022-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Platform and Manufacturing Method for Semiconductor Devices