IP Library Assignment 060873/0148
Patent Assignment
Reel/Frame 060873/0148

Assignment of Assignor's Interest

Recorded: 2022-08-23 Pages: 3
Assignors
LEE, KANGHA
Executed: 2022-07-13
SUNG, WOOKYUNG
Executed: 2022-07-13
LIM, JIN HYUNG
Executed: 2022-07-13
GU, SIN IL
Executed: 2022-07-13
LEE, JONG HO
Executed: 2022-07-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component
Application: 17/893,539 →
Publication: US 2023/0253156