Patent Assignment
Reel/Frame 060873/0566
Assignment of Assignor's Interest
Recorded: 2022-08-23
Pages: 6
Assignors
LEE, JONGGU
Executed: 2022-05-30
KIM, SUNGHYUP
Executed: 2022-05-30
KIM, JEONGDU
Executed: 2022-05-30
KIM, HYEONJIN
Executed: 2022-05-30
KIM, JUNGHWAN
Executed: 2022-06-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Chuck Table and Wafer Chuck System
Application:
17/893,659 →
Publication:
US 2023/0207369