Patent Assignment
Reel/Frame 060887/0904
Assignment of Assignor's Interest
Recorded: 2022-08-24
Pages: 6
Assignors
CHOI, HYUNMOOK
Executed: 2022-07-06
KIM, JIHONG
Executed: 2022-07-06
NA, KYOUNGCHO
Executed: 2022-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device
Application:
17/894,524 →
Publication:
US 2023/0180475