IP Library Assignment 060890/0386
Patent Assignment
Reel/Frame 060890/0386

Assignment of Assignor's Interest

Recorded: 2022-08-24 Pages: 9
Assignors
LYSACEK, DAVID
Executed: 2022-08-23
HYBL, JAN
Executed: 2022-08-23
POSTULKA, DUSAN
Executed: 2022-08-23
JARINA, JURAJ
Executed: 2022-08-23
JANIREK, VIT
Executed: 2022-08-23
SENKOVA, ALEXANDRA
Executed: 2022-08-24
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Methods of Manufacturing Semiconductor Devices and Semiconductor Devices
Application: 17/822,008 →
Publication: US 2024/0071775
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →