Patent Assignment
Reel/Frame 060893/0891
Assignment of Assignor's Interest
Recorded: 2022-08-25
Pages: 3
Assignors
LU, CHIH-HSIN
Executed: 2022-08-10
TSAI, CHUNG-HAO
Executed: 2022-08-10
WANG, CHUEI-TANG
Executed: 2022-08-10
YU, CHEN-HUA
Executed: 2022-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof