IP Library › Assignment 060908/0867
Patent Assignment
Reel/Frame 060908/0867

Assignment of Assignor's Interest

Recorded: 2022-08-26 Pages: 3
Assignors
KIM, SUNG SOO
Executed: 2022-07-07
NA, JAE YOUNG
Executed: 2022-07-07
LIM, JIN HYUNG
Executed: 2022-07-07
HAN, SEUNG HUN
Executed: 2022-07-07
JO, JI HONG
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component
Application: 17/894,273 →
Publication: US 2023/0215654