Patent Assignment
Reel/Frame 060909/0235
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 4
Assignors
JENQ, SHRANE-NING
Executed: 2022-08-23
HSU, WEN-CHENG
Executed: 2022-08-23
WANG, CHEN-YU
Executed: 2022-08-23
KUO, CHIH-MING
Executed: 2022-08-23
CHEN, CHWAN-TYAW
Executed: 2022-08-23
HO, LUNG-HUA
Executed: 2022-08-23
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device