Patent Assignment
Reel/Frame 060913/0649
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 3
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Chip Integration Module, Chip Package Structure, and Chip Integration Method