Patent Assignment
Reel/Frame 060915/0207
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 7
Assignors
AGARWAL, RAHUL
Executed: 2022-08-03
MANDALAPU, CHANDRA SEKHAR
Executed: 2022-08-08
SWAMINATHAN, RAJA
Executed: 2022-08-22
Assignee
ADVANCED MICRO DEVICES, INC.
2485 AUGUSTINE DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Partitioning Wafer Processing and Hybrid Bonding of Layers Formed on Different Wafers for a Semiconductor Assembly