Patent Assignment
Reel/Frame 060920/0545
Assignment of Assignor's Interest
Recorded: 2022-08-28
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Deep Trench Isolation Structure and Methods for Fabrication Thereof
Application:
17/850,477 →
Publication:
US 2023/0420473