Patent Assignment
Reel/Frame 060922/0119
Assignment of Assignor's Interest
Recorded: 2022-08-29
Pages: 8
Assignors
GUAN, ZHEN YU
Executed: 2022-07-21
FU, SHENG-WEN
Executed: 2022-04-29
KUANG, HSUN-CHUNG
Executed: 2022-08-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Bottom Electrode via for Memory Device