Patent Assignment
Reel/Frame 060922/0220
Assignment of Assignor's Interest
Recorded: 2022-08-29
Pages: 5
Assignors
CHEN, HSIN-HUNG
Executed: 2022-08-24
YAUNG, DUN-NIAN
Executed: 2022-08-07
LIU, JEN-CHENG
Executed: 2022-08-23
HUNG, FENG-CHI
Executed: 2022-08-07
KUO, WEN-CHANG
Executed: 2022-08-09
HSU, HUNG-WEN
Executed: 2022-08-07
LIU, SHIH-CHANG
Executed: 2022-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Backside Deep Trench Isolation (Bdti) Structure for Cmos Image Sensor
Application:
17/882,869 →
Publication:
US 2023/0361149