Patent Assignment
Reel/Frame 060922/0973
Assignment of Assignor's Interest
Recorded: 2022-08-29
Pages: 4
Assignors
KAWANA, YUKI
Executed: 2019-07-25
NAKAKO, HIDEO
Executed: 2019-07-25
NEGISHI, MOTOHIRO
Executed: 2019-07-25
ISHIKAWA, DAI
Executed: 2019-07-29
SUGAMA, CHIE
Executed: 2019-07-25
EJIRI, YOSHINORI
Executed: 2019-07-25
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Metal Paste for Joints, Assembly, Production Method for Assembly, Semiconductor Device, and Production Method for Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 29, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061331/0576 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →