Patent Assignment
Reel/Frame 060933/0652
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 3
Assignors
LIU, ZI-JHENG
Executed: 2022-08-16
YU, TING-YANG
Executed: 2022-08-16
LEE, MING-TAN
Executed: 2022-08-16
KUO, HUNG-JUI
Executed: 2022-08-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Package and Manufacturing Method Thereof
Application:
17/894,084 →
Publication:
US 2024/0071887