Patent Assignment
Reel/Frame 060933/0690
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 3
Assignors
LING, CHIA-YU
Executed: 2022-08-19
LAI, HSIN-YU
Executed: 2022-08-19
CHIANG, KATHERINE H
Executed: 2022-08-19
LIN, CHUNG-TE
Executed: 2022-08-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interposer Substrate, Package Structure and Manufacturing Method of Package Structure
Application:
17/896,083 →
Publication:
US 2024/0071936