Patent Assignment
Reel/Frame 060939/0196
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 3
Assignors
HUANG, YU-LIEN
Executed: 2022-08-17
LIU, CHIH-CHENG
Executed: 2022-08-23
LEE, TZE-LIANG
Executed: 2022-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Application:
17/896,726 →
Publication:
US 2024/0087890