Patent Assignment
Reel/Frame 060939/0365
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 5
Assignors
SU, YING-CHI
Executed: 2022-08-12
CHU, LI-WEI
Executed: 2022-07-19
CHEN, HUNG-HSU
Executed: 2022-08-05
CHANG, CHIH-WEI
Executed: 2022-07-19
TSAI, MING-HSING
Executed: 2022-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Dual Silicide in Manufacturing Process of Semiconductor Structure