Patent Assignment
Reel/Frame 060942/0775
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 4
Assignors
HUNG, WENSEN
Executed: 2022-08-21
CHEN, TSUNG-YU
Executed: 2022-08-21
SHIH, HSUAN-NING
Executed: 2022-08-21
WEI, WEN-HSIN
Executed: 2022-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Integrated Chip Package Including a Crack-Resistant Lid Structure and Methods of Forming the Same