IP Library › Assignment 060957/0201
Patent Assignment
Reel/Frame 060957/0201

Assignment of Assignor's Interest

Recorded: 2022-08-31 Pages: 3
Assignors
SHIH, CHIH-TSUNG
Executed: 2022-08-05
LIU, WEI-KANG
Executed: 2022-08-02
HSU, SUI-YING
Executed: 2022-08-11
YANG, JING-HWANG
Executed: 2022-08-02
TSUI, YINGKIT FELIX
Executed: 2022-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Semiconductor Structure with Multi-Layers Film
Application: 17/817,041 →
Publication: US 2024/0045141