Patent Assignment
Reel/Frame 060962/0679
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 5
Assignors
CHEN, JIAN-YOU
Executed: 2022-08-15
HUANG, KUAN-YU
Executed: 2022-08-15
KUO, LI-CHUNG
Executed: 2022-08-16
TSAI, CHEN-HSUAN
Executed: 2022-08-15
YEH, KUNG-CHEN
Executed: 2022-09-01
TSOU, HSIEN-JU
Executed: 2022-08-15
SHIH, YING-CHING
Executed: 2022-08-15
LU, SZU-WEI
Executed: 2022-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method