Patent Assignment
Reel/Frame 060965/0475
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Imaging Element and Semiconductor Chip
Application:
17/908,658 →
Publication:
US 2023/0095332