Patent Assignment
Reel/Frame 060968/0531
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dummy Metal-Insulator-Metal Structures Within Vias
Application:
17/901,352 →
Publication:
US 2023/0352396