Patent Assignment
Reel/Frame 060975/0389
Assignment of Assignor's Interest
Recorded: 2022-09-02
Pages: 3
Assignors
SHAO, TUNG-LIANG
Executed: 2022-08-23
HUANG, YU-SHENG
Executed: 2022-08-23
CHENG, WEN-HAO
Executed: 2022-08-24
YU, CHEN-HUA
Executed: 2022-09-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Adaptive Interconnect Structure for Semiconductor Package
Application:
17/822,879 →
Publication:
US 2024/0071965