Patent Assignment
Reel/Frame 060976/0256
Assignment of Assignor's Interest
Recorded: 2022-09-02
Pages: 6
Assignors
KANG, SUNGKUN
Executed: 2022-02-08
KOH, CHAWON
Executed: 2022-02-08
LEE, HYUNJAE
Executed: 2022-02-08
NISHI, TSUNEHIRO
Executed: 2022-02-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device
Application:
17/902,142 →
Publication:
US 2023/0076633