Patent Assignment
Reel/Frame 060976/0302
Assignment of Assignor's Interest
Recorded: 2022-09-02
Pages: 4
Assignors
LIN, CHIN-SHEN
Executed: 2022-08-23
LU, LUK
Executed: 2022-08-22
KAN, HAO-TIEN
Executed: 2022-08-24
LIAO, REN-ZHENG
Executed: 2022-08-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSING RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Device and Manufacturing Method
Application:
17/929,397 →
Publication:
US 2023/0420369