Patent Assignment
Reel/Frame 060982/0207
Assignment of Assignor's Interest
Recorded: 2022-05-11
Pages: 10
Assignors
SON, DONG WON
Executed: 2020-09-25
KIM, BYEONGHOON
Executed: 2020-09-25
CHOI, SUNG HO
Executed: 2020-09-25
LIM, SUNG JAE
Executed: 2020-09-25
SHIN, JONG HO
Executed: 2020-09-25
CHO, SUNGWON
Executed: 2020-10-06
KIM, CHANGOH
Executed: 2020-10-08
PARK, KYOUNGHEE
Executed: 2020-10-07
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
EMI Shielding for Flip Chip Package with Exposed Die Backside
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.