Patent Assignment
Reel/Frame 060983/0675
Assignment of Assignor's Interest
Recorded: 2022-09-02
Pages: 4
Assignors
CHANG, YUNG FENG
Executed: 2022-03-27
CHANG, YU-JUNG
Executed: 2022-03-24
HSIEH, TUNG-HENG
Executed: 2022-03-24
YOUNG, BAO-RU
Executed: 2022-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Chip Integration