IP Library › Assignment 060987/0152
Patent Assignment
Reel/Frame 060987/0152

Assignment of Assignor's Interest

Recorded: 2022-09-05 Pages: 3
Assignors
MADIA, ORESTE
Executed: 2022-08-23
DOORNBOS, GERBEN
Executed: 2022-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structure and Manufacturing Method Thereof
Application: 17/900,804 →
Publication: US 2024/0074315