IP Library › Assignment 060988/0770
Patent Assignment
Reel/Frame 060988/0770

Assignment of Assignor's Interest

Recorded: 2022-06-29 Pages: 5
Assignors
WU, SHANG-EN
Executed: 2022-06-24
LIANG, KENG-CHI
Executed: 2022-06-24
HO, KUANG-TSE
Executed: 2022-06-24
CHEN, HUNG-JEN
Executed: 2022-06-24
Assignee
MATERIALS ANALYSIS TECHNOLOGY INC.
1F, NO.26-2, TAIYUAN ST., ZHUBEI CITY,, HSINCHU COUNTY, 302, TAIWAN
Covered Property (1)
Soldering Quality Inspection Method and Soldering Quality Inspection Apparatus
Application: 17/853,859 →
Publication: US 2023/0029432