Patent Assignment
Reel/Frame 060998/0808
Assignment of Assignor's Interest
Recorded: 2022-09-06
Pages: 6
Assignors
HWANG, HYUNSU
Executed: 2022-04-11
KU, SUHYEON
Executed: 2022-04-11
KWEON, JUNYUN
Executed: 2022-04-11
SONG, SOLJI
Executed: 2022-04-11
OH, DONGJOON
Executed: 2022-04-11
LEE, CHUNGSUN
Executed: 2022-04-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Dry Etching Apparatus and Wafer Etching System Using the Same