Patent Assignment
Reel/Frame 061012/0200
Assignment of Assignor's Interest
Recorded: 2022-09-07
Pages: 9
Assignors
OH, JOONGSUK
Executed: 2022-07-05
KOO, JAEUNG
Executed: 2022-09-01
YOON, BOUN
Executed: 2022-08-03
YOON, ILYOUNG
Executed: 2022-08-03
LEE, KANGCHUN
Executed: 2022-07-15
LEE, SEUNGJAE
Executed: 2022-07-04
YIM, JUNHWAN
Executed: 2022-07-04
HONG, HUITEAK
Executed: 2022-07-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device Using Single Slurry Chemical Mechanical Polishing (Cmp) Process