Patent Assignment
Reel/Frame 061051/0202
Assignment of Assignor's Interest
Recorded: 2022-09-09
Pages: 4
Assignors
WANG, MENG-HAN
Executed: 2022-06-19
LIN, YU-TING
Executed: 2022-09-01
LIN, CHIA HONG
Executed: 2022-05-31
LIU, KAO CHIH
Executed: 2022-05-31
LIU, WEI-CHENG
Executed: 2022-07-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures in Integrated Circuit Chips