Patent Assignment
Reel/Frame 061055/0362
Assignment of Assignor's Interest
Recorded: 2022-08-02
Pages: 3
Assignors
AYGUN, KEMAL
Executed: 2017-09-19
QIAN, ZHI GUO
Executed: 2017-09-19
XIE, JIAN YONG
Executed: 2017-09-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Intra-Semiconductor Die Communication via Waveguide in a Multi-Die Semiconductor Package