Patent Assignment
Reel/Frame 061060/0871
Assignment of Assignor's Interest
Recorded: 2022-09-12
Pages: 8
Assignors
SHEN, YAN-TING
Executed: 2021-02-19
YU, CHIA-CHI
Executed: 2021-02-19
LIAO, CHIH-TENG
Executed: 2021-02-19
LIN, YU-LI
Executed: 2021-02-19
CHENG, CHIH HSUAN
Executed: 2021-02-19
WENG, TZU-CHAN
Executed: 2021-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Including Etching Polysilicon