Patent Assignment
Reel/Frame 061066/0182
Assignment of Assignor's Interest
Recorded: 2022-09-12
Pages: 8
Assignors
TSAI, HANLUNG
Executed: 2021-03-15
CHEN, MINGCHIH
Executed: 2021-03-15
LIN, CHENGCHUNG
Executed: 2021-03-29
Assignee
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
78 CHANGSHAN AVENUE, JIANGYIN CITY, JIANGSU PROVINCE, 214437, CHINA
Covered Property
(1)
Semiconductor Package Structure with Heat Sink and Method Preparing the Same